S500 3D BGA Reballing Stencil CPU Logic Module BGA Reballing Repair Tool for iPhone 5 5S 6 6S 7G 7Plus 8 8P

Features:

3D laser square hole BGA reballing stencil template.

High-speed numerical control technology and high-temperature resistant toughened materials production,round square precise hole posttion,make steel net more durable,easier to take off the net,more efficient.

New patented iphone X Middle Layer Motherboard  for iPhone X Middle layer motherboard.

Assisting professionals to do iPhone X BGA reballing in the most convenient and safest way.

 

Specification:

Type: A7 CPU / A8 CPU / A9 CPU / A10 CPU / A11 CPU

 

Package included:

1 x BGA Reballing Tool

 

Details pictures: