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Qianli CPU Module Motherboard Reballing Kit Stencils Tin Planting Network Steel Net Repair Tool for Phone 5S/6/6S/7/7P/8/8P A7 A8 A9 A10 A11

Qianli CPU Module Motherboard Reballing Kit Stencils Tin Planting Network Steel Net Repair Tool for Phone 5S/6/6S/7/7P/8/8P A7 A8 A9 A10 A11

  • Save R 331.05
Tax included.
SKU:
Features:

3D laser square hole BGA reballing stencil template.
High-speed numerical control technology and high-temperature resistant toughened materials production,round square precise hole posttion,make steel net more durable,easier to take off the net,more efficient.
New patented phone X Middle Layer Motherboard  for Phone X Middle layer motherboard.
Assisting professionals to do Phone X BGA reballing in the most convenient and safest way.
 
Specification:

Type: A7 CPU / A8 CPU / A9 CPU / A10 CPU / A11 CPU
 
Package included:

1 x BGA Reballing Tool
 
Details pictures: