Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 8 8P Motherboard IC Chip Ball Soldering
Tax included.
Features:
Efficient: quick alignment for operating of reballing
Easy: positioning pins for precise alignment
Durable: Long Time Operating and Usage Lifetime
Application Model: iphone 8 Plus, 8
Function: Repairing or fixing problem of iphone 6s Plus 6s processor
Package includes:
1 x BGA Reballing Stencils for iPhone 8/8P
Details pictures:
