![Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 7 7P Motherboard IC Chip Ball Soldering](http://www.electronicpro.co.za/cdn/shop/products/199bdf6a-623e-4828-9e7c-9b75577b9d00_{width}x.jpg?v=1587818582)
Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 7 7P Motherboard IC Chip Ball Soldering
Tax included.
Features:
Efficient: quick alignment for operating of reballing
Easy: positioning pins for precise alignment
Durable: Long Time Operating and Usage Lifetime
Application Model: iphone 6s Plus, 6s
Function: Repairing or fixing problem of iphone 6s Plus 6s processor
Package includes:
1 x BGA Reballing Stencils for iPhone 6s/6SP
Details pictures: