Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 6S 6SP Motherboard IC Chip Ball
Tax included.
Features:
Efficient: quick alignment for operating of reballing
Easy: positioning pins for precise alignment
Durable: Long Time Operating and Usage Lifetime
Application Model: iphone 6s Plus, 6s
Function: Repairing or fixing problem of iphone 6s Plus 6s processor
Package includes:
1 x BGA Reballing Stencils for iPhone 6s/6SP
Details pictures:
