1 Bottles BGA Reballing Balls (0.3 0.4 0.5 0.6 ) BGA Solder Ball leaded For BGA Rework Repair Tool
Tax included.
Features :
BGA soldering station must
Compliance with ROHS specifications
It is of good electrical conductivity and mechanical connection performance.
With this product, it will not be necessary to clean up the welding plate, and directly drag the tin point on the main plate and bridge for BGA welding, which will be faster and won't damage the welding plate due to mistakes.
Widely used in tinplate, flux, organic synthesis, chemical production, alloy manufacturing, and assembly of multiple integrated circuits in the electronics industry.
Specification :
size:
0.3mm: 15g
0.4mm: 20g
0.5mm: 25g
0.6mm: 30g
Color: Sliver
Package includeds :
1 bottles 25k
Details pictures :
