Akasa AK-460 Silicone Technology Thermally Compound for CPU Cooler Heat Sink
Tax included.
Specification:
1. Model: AK-460
2. Application: Thermally conductive compound
3. Form: Non-curing
4.Thermal conductivity: 3.3 W/mK
5.Specific gravity: 3.5
6. Operating temperature: -45°C to 200°C
7. Thermal resistance: 0.16cm²C/W @60um BLT
8. Colour: Grey
9. Volume: 3.5g
Features:
1. An evolution in silicone technology delivers outstanding thermal performance,
Pro-grade silicone technology provides a stable thermal compound which delivers a great thermal performance.
Minimised resistance and maximised efficiency truly enables you to get a lot more from your cooler. RoHS compliant.
2. Outstanding performance of heat transfer between CPU and heatsink .
3. Low thermal resistance for heat transfer, 0.16cm²C/W @60 um BLT.
4. Maximum thermal conductivity, 3.3W/mK.
5. Electrically non-conductive.
6. Multi-language instructions included.
Package included:
1 * Akasa AK-460 Silicone Technology Compound
1. Model: AK-460
2. Application: Thermally conductive compound
3. Form: Non-curing
4.Thermal conductivity: 3.3 W/mK
5.Specific gravity: 3.5
6. Operating temperature: -45°C to 200°C
7. Thermal resistance: 0.16cm²C/W @60um BLT
8. Colour: Grey
9. Volume: 3.5g
Features:
1. An evolution in silicone technology delivers outstanding thermal performance,
Pro-grade silicone technology provides a stable thermal compound which delivers a great thermal performance.
Minimised resistance and maximised efficiency truly enables you to get a lot more from your cooler. RoHS compliant.
2. Outstanding performance of heat transfer between CPU and heatsink .
3. Low thermal resistance for heat transfer, 0.16cm²C/W @60 um BLT.
4. Maximum thermal conductivity, 3.3W/mK.
5. Electrically non-conductive.
6. Multi-language instructions included.
Package included:
1 * Akasa AK-460 Silicone Technology Compound